>>Read this information in Japanese/日本語で読む

The Mitsubishi Corporation （三菱商事）has released their scholarship application information for Spring 2021.

Application Guide and Documents (Only accessible within campus network)
https://www.sci.tohoku.ac.jp/direct/gakunai/2021_mitsubishi.zip

<Eligibility>
Note: The detailed information should be referred to the application guide.
・Student who is the 3rd or 4th year of undergraduate student, Master's student, or Doctoral student as of April 2021
・Student who has one year or longer to complete the current program as of April 2021
・Student who has not received the Mitsubishi Corporation International Sholarship in the past
・Student who has no plan for studying abroard for 6 months or longer

<Scholarship Amount>
Undergraduate Students: 120,000 yen/month
Graduate Students: 150,000 yen/month

<Scholarship payment period>
From April 2021 to until completing the program period (within the designated normal program period)

<Items to be submitted>
・Application form (Form 1) with ID photo
・Recommendation (Form 2); it should be made by your supervisor
・Academic transcript from the undergraduate program to the latest one
・For those who go on to the advanced program in April 2021, submitting a copy of the Letter of Acceptance is required
・Copy of Residence card (both sides)

<Note>
1. Academic transcript:
・It should be included for academic year 2019.
・Grade point calculation should be made based upon the academic transcript for academic year 2019.
* If you are not able to submit the academic transcript for academic year 2019, you need to submit the statement of reason (any format is acceptable). In such a case, the column for the grade point on the recommendation can be blank, however, comment from the supervisor about your grade is required.

2. Application form in English
・It can be used for English program students only (AMC & IGPAS) .
・Other than AMC & IGPAS students, application form in Japanese should be used.

3. Typed forms
・It is advisable to make your application form by using the computer.

<How to submit & Application Deadline>
Submit them to the Student Support Section via postal mail or in-campus mail (gakunai-bin) by Friday, December 18, 2020.
* If you submit the documents via postal mail, please email to the Student Support Section.

<Attention>
・If you come to the university campus, you are allowed to visit and submit to the Student Support Section window in Aobayama campus.
・As a rule, you can not apply for this one if you are receiving/applying for any other scholarships

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Student Support Section, Academic Affairs Division, School of Science
E-mail: sci-sien[at]grp.tohoku.ac.jp
Postal mail: 6-3 Aza-Aoba, Aramaki, Aoba-ku 980-8578 Sendai
In-campus mail: 青A-5